Substrate and Component Attach Paste Adhesives are Designed for Stress-Free Large Area Bonding with Molecularly Engineered Polymer Structures
AIT has many proven epoxy paste adhesives for thermal management in component and substrate attachment. The ME8456 series of flexible conductive adhesives has been the mainstay of conductive adhesives used for microwave applications in military electronics with 20 years of proven success.
The following tables are representative of products that have been engineered for:
- Microwave large and small area substrate attach
- Inline curing SMT adhesive with outstanding pot-life and dispensing properties
- Patented solder-replacement component attach conductive adhesives
Non-conductive Substrate Attach Paste
AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity(watt/m-°C) | Die-shear (psi) | Tg (°C) | Viscosity/ Thixotropic Index |
---|---|---|---|---|---|---|
EG7655 |
| >1×1014 | >1.7 | >1,800 | -20 | 300,000(cps@ 0.5 rpm) |
EG7658 |
| >1×1014 | >3.67 | >1,800 | -25 | 337,000(cps@ 0.5 rpm) |
ME7155 |
| >1×1014 | >1.7 | >1,800 | -25 | 276,000(cps@ 0.5 rpm) |
ME7155-AN |
| >1×1014 | >3.6 | >1,800 | -25 | 245,000(cps@ 0.5 rpm) |
ME7156 |
| >1×1014 | >1.7 | >2,400 | -25 | 144,000(cps@ 0.5 rpm) |
ME7158 |
| >1×1014 | >3.6 | >1,800 | -25 | 250,000(cps@ 0.5 rpm) |
ME7159 |
| >1×1014 | >11.4 | >1,800 | -25 | 310,000(cps@ 0.5 rpm) |
ME7630-RC |
| >1×1014 | >1.2 | >3,000 | 60 | 10,000(cps@ 0.5 rpm) TI >4.0 |
ME7655-RC |
| >1×1014 | >2.2 | >1,500 | -40 | 10,000(cps@ 0.5 rpm) TI >4.0 |
ME7656 |
| >1×1014 | >3.6 | >1,200 | -10 | 200,000(cps@ 0.5 rpm) |
ME7857-SC |
| >1×1013 | >2.9 | >1,200 | -60 | 60,000(cps@ 5 rpm) |
New product:
ME7563 with modified zinc oxide crystallite filled for lowest thermal resistance
Electrically Conductive Substrate Attach Paste
AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity(watt/m-°C) | Die-shear (psi) | Tg (°C) | Viscosity |
---|---|---|---|---|---|---|
EG8050 |
| <4×10-4 | >6.0 | >1,800 | -20 | 300,000(cps@ 0.5 rpm) |
ME8155 |
| <4×10-4 | >6.0 | >1,800 | -25 | 337,000(cps@ 0.5 rpm) |
ME8452-A |
| <4×10-4 | >6.0 | >1,800 | -25 | 276,000(cps@ 0.5 rpm) |
ME8456-00 |
| <4×10-4 | >12.5 | >1,200 | -20 | 60,00(cps@ 2.5 rpm) |
ME8456-LV GS002 |
| <4×10-4 | >7.9 | >2,400 | -25 | 144,000(cps@ 0.5 rpm) |
ME8650-RC |
| <4×10-4 | >6.0 | >1,500 | -20 | 15,000(cps@ 0.5 rpm) TI >4 |
ME8850-DA |
| <4×10-4 | >6.0 | >1,800 | -25 | 250,000(cps@ 0.5 rpm) |
New Product:
ME8560: silver filled, 100% solid without solvent or diluent, electrically conductive adhesive
For a recommendation, information or assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308