MIL-STD 883C 5011.4 Compliant
MIL-STD 883C Method 5011.4 Qualified Adhesive Products
Test Procedures: Mil-Std 883C Method 5011.4
Test Conditions: Per Specification
Tests Performed: 1989 to 1996
Acceptability: Both material characteristics and system level performances must meet requirements
AIT Product | Characteristics | Electrical Resistivity(ohm-cm) | Thermal Conductivity(watt/m-°C) | Die-shear | Tg (°C) |
---|---|---|---|---|---|
ESP8350 | FlexibleAmbient storagedry epoxy film | >1×1014 | >1.7 | >2,000 | -60 |
ME7155 | 1-component flexibleepoxy paste | >1×1014 | >1.7 | >1,000 | -25 |
ME7156-NG | 1-component flexibleepoxy paste | >1×1014 | >1.7 | >1,000 | -25 |
ME7159 | 1-component flexibleepoxy pasteDiamond filled | >1×1014 | >11.4 | >1,000 | -25 |
ME8412 | 1-component rigidepoxy paste | <5×10-4 | >7.9 | >2,000 | 130 |
ME8456 | 1-component flexibleepoxy paste | <4×10-4 | >7.9 | >1,000 | -20 |
ME8456-GE | 1-component flexibleepoxy paste | <5×10-4 | >5.7 | >2,000 | -25 |
ME8456-00 | 1-component flexibleepoxy paste | <4×10-4 | >12.5 | >1,200 | -20 |
TC8750 | Tacky epoxy film | <5×10-4 | >6.4 | >2,400 | 0 |
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308