Insulated Metal Substrate Laminates for Metal Core Printed Circuit Boards (MCPCB)
- For LED and High Power Modules
Light emitting diode (LED) lighting and LED display require high thermal dissipation performance, low cost LED substrate and long-term reliability. AIT insulated metal substrate laminate is ideal for these Metal Core Printed Circuit Board (MCPCB) applications and are available in high volume and fast delivery at costs that are among the lowest in the industry.
AIT patented (US patent#7,154,046; 6,717,819; 6,580,035; 6,581,276; 6,108,210; 6,297,564; 6,665,193; 6,973,716) insulated metal substrates provide unparalleled thermal and reliability performance. AIT insulated metal substrate differs from traditional Insulated Metal Substrate thermal circuit substrate in the following areas:
- LED substrates contain insulated metal for printed circuit boards.
- Instead of a thermally conductive rigid fiberglass epoxy laminate, AIT uses a proprietary flexible thermal dielectric insulating layer resulting in stress and warp-free thermal copper-clad laminates with proven low thermal resistance.
- Unparalleled thermal conductivity in the insulating layer by eliminating fiberglass fabrics.
- High temperature stability to withstand soldering at 300°C.
- Multi-layer capability with the same flexible dielectric copper-clad pre-preg that can be laminated at less than 14 psi pressure and at 125°C or higher.
- Base metal plates with choice of aluminum and copper from 35 mils to 350 mils.
- Thinner insulated metal substrate and pre-preg are available in rolls of 12-inch width.
- Thicker insulated metal substrate and pre-preg are available in sheets of 12-inch by 24-inch.
- Ideal for power and LED components and modules.
AIT insulated metal substrate laminates for Metal Core Printed Circuit Board (MCPCB) have the lowest proven thermal resistance among this class of thermal substrate laminates. AIT’s thermally conductive laminates are available with 1, 2 or 4 oz copper on 40 or 60 mil aluminum plate panels of 20-inch by 24 inch and a dielectric layer of 75 micron. AIT IMTS offers unparalleled advantages, such as having two times more thermal conductivity and zero internal stress for long-term reliability.
An additional heatsink fin can be easily attached to the power devices made with insulated metal thermal substrate. AIT thermal conductive adhesives are known for their low thermal resistance and ease of use as a thermally conductive adhesive paste or film.
Single-Sided Insulated Metal (Metal Core Printed Circuit Board, MCPCB) Substrate for Power & LED Modules.
Typical Dielectric Properties of Cool-Clad™ CXP Series for High Performance MCPCB:
| PROPERTY/PARAMETER | VALUE |
| Electrical Resistivity of Dielectric Layer | >10¹⁴ ohm-cm |
| Dielectric Strength of Dielectric Layer @ 25 Micron Thickness (Volts/mil) | >1000 V/mil |
| Glass Transition Temp. of Dielectric Layer (°C) | 200 |
| Peel Strength o Dielectric Layer (Pound/inch) | >6 |
| Device Push-off Strength of Dielectric Layer (psi) | >2000 |
| Hardness of Dielectric Layer (Type) | > 95 (D) |
| Cured Density of Dielectric Layer (gm/cc) | 2.5 |
| Thermal Conductivity of Dielectric Layer | 3 W/m-°C |
| Linear Thermal Expansion Coefficient of Laminate (ppm/°C) | 19 |
| Maximum Continuous Operation Temp. (°C) | 250 |
Typical Dielectric Properties of Cool-Clad™ ESP Series for Flexible Circuits MCPWB:
| PROPERTY/PARAMETER | VALUE |
| Electrical Resistivity of Dielectric Layer | >10¹⁴ ohm-cm |
| Dielectric Strength of Dielectric Layer @ 75 Micron Thickness (Volts/mil) | >1000 V/mil |
| Glass Transition Temp. of Dielectric Layer (°C) | -55 |
| Peel Strength (Pound/inch) | >3 |
| Device Push-off Strength of Adhesive Layer (psi) | >1500 |
| Hardness of Adhesive Layer (Type) | > 80 (A) |
| Cured Density of Dielectric of Adhesive Layer (gm/cc) | 2.5 |
| Thermal Conductivity of Adhesive Layer | 3 W/m-°C |
| Linear Thermal Expansion Coefficient of Laminate (ppm/°C) | 19 |
| Maximum Continuous Operation Temp. (°C) | > 180 |
| AIT Product | Characteristics | Copper Thickness(oz) | Thermal Resistance(°C/W-in2) | Nominal Stack Thickness (mils) | Dielectric Strength of Insulating Layer(Volt/mil) | Dielectric Constant of Insulating Layer |
|---|---|---|---|---|---|---|
| COOL-CLAD™ CXP CC-AL-SS-1 |
| 1 | <1.5 | 65/66 | >1000 | 4.5 |
| COOL-CLAD™ CXP CC-AL-SS-2 |
| 2 | <1.5 | 67/68 | >1000 | 4.5 |
| COOL-CLAD™ (CXP or ESP) CC-AL-SS-3 |
| 3 | <1.5 | 68/69 | >1000 | 4.5 |
| COOL-CLAD™ CXP CC-AL-SS-4 |
| 4 | <1.5 | 70/71 | >1000 | 4.5 |
| COOL-CLAD™ CXP CC-AL-SS-5 |
| 5 | <1.5 | 72/73 | >3000 | 4.5 |
| COOL-CLAD™ CXP CC-AL-SS-6 |
| 6 | <1.5 | 73/74 | >3000 | 4.5 |
Double-Sided Copper-Clad Laminates (Metal Core Printed Wiring Board) for Power & LED Modules
| AIT Product | Characteristics | Copper Thickness(oz) | Thermal Resistance( °C/W-in2) | Nominal Stack Thickness (mils) | Dielectric Strength of Insulating Layer(Volt/mil) | Dielectric Constant of Insulating Layer |
|---|---|---|---|---|---|---|
| COOL-CLAD™ CXP CC-CU-DS-1 |
| 1 | <1.1 | 65/66 | >1000 | 4.5 |
| COOL-CLAD™ CXP C-CU-DS-2 |
| 2 | <1.1 | 67/68 | >1000 | 4.5 |
| COOL-CLAD™ CXP CU-DS-3 |
| 3 | <1.1 | 69/70 | >1000 | 4.5 |
| COOL-CLAD™ CXP CC-CU-DS-X |
| Custom | <1.1 | Custom | >1000 | 4.5 |
| COOL-CLAD™ CXP CC-CU-OX-DS-X |
| Custom | <1.1 | Custom | >3000 | 3.9 |
Flexible Thermal Copper-clad Pre-preg for Power & LED Modules
| AIT Product | Characteristics | Copper Thickness(oz) | Thermal Resistance(°C/W-in2) | Nominal Stack Thickness (mils) | Dielectric Strength of Insulating Layer(Volt/mil) | Dielectric Constant of Insulating Layer |
|---|---|---|---|---|---|---|
| COOL-CLAD™ ESP CU-1 |
| 1 | <1.1 | 5/6 | >1000 | 4.5 |
| COOL-CLAD™ ESP CU-2 |
| 2 | <1.1 | 7/8 | >1000 | 4.5 |
| COOL-CLAD™ ESP CU-X |
| Custom | <1.1 | Custom | >1000 | 4.5 |
Typical Multi-Layer Processing Parameters for Cool-Clad™:
| PRE-PREG PROCESSING FOR COOL-CLAD CXP | CXP7685-PP |
| Storage and Shelf Life | Ambient in original package |
| Lamination Temperature, Pressure and Time | 150-175°C/10-15 psi/>30 second |
| Post Curing (Without Pressure) | Same temperature as lamination |
| PRE-PREG PROCESSING FOR COOL-CLAD ESP | ESP7455-PP |
| Storage and Shelf Life | Ambient in original package |
| Lamination Temperature, Pressure and Time | 150-175°C/10-15 psi/>30 second |
| Post Curing (Without Pressure) | Same temperature as lamination |
OTHER RELATED TECHNOLOGIES FROM AI TECHNOLOGY
Solderable Flexible Circuit Copper Clad Laminate (COUPLER-C):
| Characteristics | Unit | Conditioning | Typical Values | Specification |
|---|---|---|---|---|
| Volume Resistivity | Mohm-cm | C-96/35/90 | 5X107~5X108 | 106 |
| Surface Resistivity | Mohm | C-96/35/90 | 5X105~5X106 | 105 |
| Permittivity 1 MHz | – | C-24/23/50 | 3.9-4.5 | 5.4 |
| Loss Tangent 1 MHz | – | C-24/23/50 | 0/013-0.020 | 0.035 |
| Arc Resistance | Sec | D-48/50 + D-0.5/23 | 100 | 60 |
| Dielectric Breakdown | KV | D-48/50 | 45 | 40 |
| Moisture Absorption | % | D-24/23 | 0.01-0.20 | 0.35 |
| Flammability | – | C-24/23/50+E-24/125 | 94V0 | 94V0 |
| Peel Strength 1oz | Lb/in | 288°C Solder Floating | 8 | 8 |
| Thermal Stress | Sec | 288°C Solder Dipping | 600 | 300 |
For a recommendation, information or assistance, please contact AIT sales and engineering:
AIT sales and customer service: 1-609-799-9388 or 1-800-735-5040, Fax: 609-799-9308