Conductive silicone compressible adhesive (e.g. SR-8850-3) and dispensible is ideal for form-in-place EMI/RFI shielding gasket in cellular phone, PDA and other consumer electronic devices.
Conductive pressure sensitive Z-axis conductive adhesive pre-applied onto EMI/RFID shielding cover/can/lid is ideal for communication devices that cannot withstand multiple high temperature lead-free soldering.
Isotropic conductive and anisotropic conductive laminate adhesives; conductive sealants caulks for form-in-place gasket pre-applied EMI/RFI Shielding COVER/CAN/LID
Flexible conductive pressure sensitive adhesive laminates used in shielding flexible printed circuit board are critical for the reduction of EMI noises in the smartphone applications
Flexible printed circuit board EMI/RFI Shielding: Laminate Conductive Adhesives
| AIT Product | Characteristics | Electrical Resistivity(ohm-cm) | Bond Strength | Storage Life |
|---|---|---|---|---|
| SPC8015 (Pressure Sensitive, In-situ curable) |
| <5×10-4 | >600 psi | 12 Months min. |
| SPC8075 (Instant Melt-Bonding) |
| <5×10-4 | >600 psi | 12 Months min. |
AIT has been supplying EMI/RFI shielding adhesives, caulks, and specialty coatings for military applications for more than 30 years. The following are some of the typical products and applications. Please contact us for your specific applications.
EMI/RFI/EMP Shielding Solutions
Conductive Adhesive & Form-In-Place Gasket
| AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Peel Strength | Pot-life(min.) | Curing Schedule (50%RH@25°C) |
|---|---|---|---|---|---|
| SR8850-2 (Silicone) | Silver/copper filled; adhesive; over 120dB EMI/RFI shielding at 0.1cm bond-line; ideal for bonding gaskets. | <5×10-3 | 4.5 ppi | 60 | 24 hr. |
| SR8850-3 (Silicone) | Silver filled; adhesive; over 120dB EMI/RFI shielding at 0.1cm bond-line; ideal for bonding gaskets. Dispensible and ideal for form-in-place gasket. | <5×10-4 | 4.5 ppi | 60 | 24 hr |
| EG8020 (Epoxy, Rigid) | Conductive Ag-filled epoxy for bonding and sealing; over 40 Amp/sq mm current capability. | 1×10-4 | 10.0 ppi | 240 | 24 hr. |
Conductive Caulk-Sealant
| AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Peel Strength | Pot-life(min.) | Curing Schedule (50%RH@25°C) |
|---|---|---|---|---|---|
| SR8850-1 (Silicone) | Metal powder filled; low density for large area coverage; extremely flexible for caulking use; over 120dB shielding. | 5×10-3 | 2.5 ppi | 90 | 24 hr. |
| PIS9006 (Non-Silicone) | Metal powder filled; low density for large area coverage; extremely flexible for caulking use; over 120dB shielding. | 5×10-3 | 2.5 ppi | NA | 24 hr. |
Conductive Coating
| AIT Product | Characteristics | Electrical Resistivity | Peel Strength | Pot-life(min.) | CuringSchedule(50%RH@25°C) |
|---|---|---|---|---|---|
| EG8020HC-MM (Rigid Epoxy) | Most conductive Ag-filled epoxy coating; over 50A/sq. mm current capacity for lightning and EMP protection. | < 9×10-5ohm-cm | 95 ppi | 240 | 24 hr. |
| EG8050-MM (Flexible Epoxy) | Most conductive Ag-epoxy that is flexible as silicone and polyurethane; excellent adhesion to most substrates. | < 5×10-4ohm-cm | 95 ppi | 240 | 24 hr. |
| SPC8513-1XCU (Bondable Copper Sheet) | 24-inch copper rolls with conductive pressure sensitive that can be die-cut and applied onto plastic and large area enclosure as “sheet-coating ” to provide more than 60dB shielding effectiveness. It conforms to most common curvatures without spray-coating problems. The exposed surface is insulating to prevent bridging with devices. | 1 oz copper liner | >3.0 ppi | 12 mos. | 3/0.075 |
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT sales and customer service: 1-609-799-9388 or 1-800-735-5040, Fax: 609-799-9308