Compressible Gasket Sheets

SHEET GASKET: Specialty Conductive Gasket

AIT Product	Characteristics	Electrical Resistivity(ohm-cm)	Peel Strength(ppi)	Thickness(mil/mm)
SPG 8006 (Pressure Sensitive)	Conductive pressure sensitive sheet that can be die-cut into any shape gasket to provide >120dB shielding against EMI/RFI . Extremely conformable.	<5×10-2	>3.0 ppi	20/ 0.540/ 1.0
SPG 8056 (Dry & Conformable)	Conductive sheet (conductive coating on insulating silicone core) that can be die-cut into any shape gasket to provide >120dB shielding against EMI/RFI . Available with one side conductive pressure-sensitive adhesive.	<5×10-2	NA	20/ 0.540/ 1.0
SPG 8055 (Dry & Conformable)	Conductive sheet (conductive coating on insulating silicone core) that can be die-cut into any shape gasket to provide >120dB shielding against EMI/RFI . Available with one side conductive pressure-sensitive adhesive.	<5×10-4	NA	20/ 0.540/ 1.0

“SHEET-COATING™ “: Ease of Application in Pre-Cut Preform

AIT Product	Characteristics	Electrical Resistivity(ohm-cm)	Bond Strength	Storage Life
SPC8015 (Pressure Sensitive, In-situ curable)	Withstand leadfree soldering temperature of over 300°C and maintain high flexibility Low weight, low thickness of 20 micron laminate with conductive adhesive over insulating dielectric for ease of application In-situ curing after instant pressure sensitive bonding of over 100 psi for bond strength at high temperature	<5×10-4	>600 psi	12 Months min.
SPC8075 (Instant Melt-Bonding)	Flexible conductive shielding laminate with conductive PSA adhesive over dielectric layer with thickness of 20 micron Pressure sensitive for instant bonding that is curable to over 1000 psi bonding Withstands soldering and high temperature operations of up to 300°C	<5×10-4	>600 psi	12 Months min.

COMPONENT-MODULE EMI/RFI SHIELDING: Covers & Lids with Pre-Applied Conductive Preform

AIT Product	Characteristics	Electrical Resistivity(ohm-cm)	Bond Strength	Storage Life
CB 8250-E (Pressure Sensitive, In-situ curable)	Suitable for flat mating area of 250 micron or wider. Low cost pre-applied on your parts or your design. In-situ curing after bonding for bond strength at high temperature.	5×10-4	>600 psi	12 Months min.
CB 8130 (Instant Melt-Bonding)	Suitable for contour and flat area of 250 micron or wider. Low cost pre-applied on your parts or your design. Low melt-bonding and rework temperature @ 130°C	5×10-4	>600 psi	12 Months min.

For more information and recommendation assistance, please contact AIT sales and engineering:

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308