COOL-GEL™ is another AIT innovation in thermal inferface materials.  COOL-GEL™ is a thermal interface gel in grease format for ease of application for critical thermal interfacing requiring high reliability without heat of provision of clips or pressure. COOL-GEL™ thermal gel dispenses like any silky thermal grease thermal interface material that will cure under device generated heat into a gel like structure. The dispensed grease form provides immediate and continual thermal interface performance with or without gelation process.

COOL-GREASE™ like COOL-SILVER G4 and COOL-GREASE ZX, measures the lowest thermal resistance among thermal interface materials that have been proven in both industrial electronics and hobbyist applications of over-clocking and do-it-yourself computers and electronics.  The lowest thermal interface resistance and thus best performing lowering of device temperature is achieved immediately upon dispensing and placement of CPU, GPU and other power devices between heatsinks. The grease is non-silicone and thus non-migrating to provide long-term performance without “drying” or “pumped-out” worry.

Purchase COOL-SILVER G4 Sample for Testing: http://www.ebay.com/itm/COOL-SILVER-G4-Thermal-Heatsink-CPU-Grease-Interface-Material-TIM-1cc-Syringe-/161276213405?pt=US_Thermal_Compounds_Supplies&hash=item258ccfb89d

COOL-GELFILM™ is another innovation that is a thermal interface gel in film format for ease of application for critical thermal interfacing requiring high reliability without heat of provision of clips or pressure. This compressible and comformable thermal interface material does not phase change but is pressure sensitive to provide immediate thermal interface performance.

COOL-GAPFILL™ is yet another enhanced thermal gap-filling material that provides extreme thermal conductivity and thus unparalleled thermal interface resistance for board level multiple component thermal management. It is designed to provide conformability and compressibility to bridge the thermal gap of large boards and sensitive components. It is non-phase changing and non-silicone and thus will not contaminate components. One side remains dry but conformable for easy removal while the heat-sinking or heat-spreading side is pressure sensitive to provide the optimum thermal interface with low thermal impedance and thermal resistance.

AIT invites anyone interested to make compressible phase-change materials or to use it for electronic and device applications based on its US patent 6,496,373 to contact us for licensing.