Wafer and Substrate Thinning Temporary Bonding Wax Coating and Wax Film

BACKGRINDING & THINNING TEMPORARY BONDING “IPA-WAX” SPIN-COATING AND ADHESIVE FILM SOLUTIONS for WAFERS and SUBSTRATES

• Spin Coating IPA Wax Solution for 2-15 Micron Temporary Bonding
• IPA Soluble Temporary Bonding Films of 12 and 25 Micron
• Ideal as protective coating for protecting wafer surface against KOH and other chemical etching processes
• Reversible bonding and debonding with simple mechanical slip push at moderate temperature above the melting point of the IPA soluble wax

Specialty substrate such as Sapphire submout for LED and specialty wafer may need to be thinned before front-end semiconductor processing, temporary bonding wax that can be spin-coated or film melt-bonding and easily removed with IPA solvent are some of the proven and tried solutions. AIT provides such solution that can be withstand temperature of operations up to 75°C and 125°C respectively.

In addition to its proven record of usage and unparalleled feats of high vacuum, high temperature and low thermal resistance, AIT temporary bonding adhesives are the most comprehensive material solutions innovated and manufactured in the United States.  AIT has extensive experience using high tech materials and chemists to formulate and customize temporary bonding materials and solutions for the critical semi-conductor and microelectronic operations of thinning for advanced operations and performance.

1. Pioneering and proven high temperature controlled peel and UV release tapes for operations at temperatures from 150°C to as high as 250°C for short periods.
2. For LED sub-mount thinning, wafer rough and fine grinding with IPA solution temporary adhesive leaves absolutely no residuals post grinding. Bonding and debonding with minimum vacuum or mechanical pressure of less than 10 psi at temperatures of 90-125°C. AIT provides large area film “wax” (IPA solution) with the same performance and ease of cleaning.
3. Proven solution in temporary bonding thermal grease-gel including “industry-standard” high vacuum etching, CGR7016 and CGR7018, and melt-bonding electro-thermal film pads including CB8130, CPR8850, etc.
4. Ultra-low water absorption and sensitivity.
5. RoHS, REACH and WEEE compliant.
6. AIT’s team of engineers, chemists and material scientists stand ready to help select and customize a temporary bonding solution for specific processing parameters.

The extensive AIT reversible temporary bonding solutions are engineered specifically for the processing of compound semiconductors that often require back-thinning of the processed wafers or backside lithography. Wafers of GaAs, InP, SiC and other compounds are expensive and have relatively poor mechanical properties.

AIT’s reversible bonding wax film and spin coating solution are also ideal for carrier or submount substrate back-thinning and backside lithography processing. These carrier or submount substrates are typically sapphire, quartz, glass, or in some cases Si wafers.