Substrate Attach Film Adhesives

AIT flexible film adhesives for substrate attach include the following:

  • Dry epoxy film adhesives
  • Tacky pressure sensitive epoxy film adhesives
  • Thermally conductive insulating film and paste adhesives
  • Electrically conductive film and paste adhesives
  • Molecularly flexible stress free bonding

AIT die-cutting services:

  • Rotary die-cutting for large volume
  • Laser die-cutting for special shapes and sizes
  • Programmable machine die-cutting for precision parts
  • Steel rule die for thick parts

Flexible Film Adhesive For Reliable Substrate And Component Attach

AIT has pioneered the use of flexible substrate-attach film adhesives since 1985. Its flag-ship products such as TC8750 and ESP8450-WL have found many successful applications over the last 20 years. Continuing this innovative heritage, the following “Substrate and Component Attach Film” adhesives represent products that are engineered for both manufacturability and reliability.  AIT’s products provide the following features:

  • Molecularly flexible for stress-free bonding for large area substrates and components
  • All specialty film adhesives are available in dry tack-free or tacky pressure sensitive formats for large and low volume manufacturing
  • Ability to withstand 250°C exposure such as wire-bonding
  • Low moisture absorption for ultimate reliability
  • “Instant melt-bondable” thermoplastic substrate-attach films Electrically Conductive Film Adhesives

The following tables outline featured AIT products:

Electrically Conductive Film Adhesives

AIT ProductCharacteristicsElectrical Resistivity (ohm-cm)Thermal Conductivity (watt/m-°C)Die-shear (psi)Tg (°C)Film Type

ESP8450-WL

  • Instant melt-tack >120°C (<10 psi)
  • Curing without fixture and pressure
  • Withstands >150°C wire-bonding
  • Low moisture absorption
  • Proven reliability for large area bonding
<4×10-4>6.0>1,500-45Tack free dry film Preforms 3-12 mils (thick)
RTC8750
  • Tacky for instant placement without fixture
  • Ambient storable for 6 months
  • Curing with fixture or low pressure
  • Withstands high temperature excursions
  • Molecularly flexible for low interfacial stress
  • Proven reliability for large area substrates
<4×10-4>6.0>1,500-25Tacky film Preforms 3-12 mils (thick)
TC8750
  • Tacky for instant placement without fixture
  • Curing with fixture or low pressure
  • Withstands high temperature excursions
  • Molecularly flexible for low interfacial stress
  • Meets MIL-STD-883 5011.4
  • Passes NASA outgassing requirements
  • Proven reliability for large area substrates
<4×10-4>8.0>1,5000Tacky film Preforms 3-12 mils (thick)

Electrically Non-conductive Film Adhesives

AIT ProductCharacteristicsElectrical Resistivity (ohm-cm)Thermal Conductivity (watt/m-°C)Die-shear (psi)Tg (°C)Film Type
TK7758
  • Tacky for instant placement without fixture
  • Curing with fixture or low pressure
  • Withstands high temperature excursions
  • Molecularly flexible for low interfacial stress
  • Proven reliability for large area substrates
>1×1014>3.6>1,500-20Tacky film Preforms 3-12 mils (thick)
ESP7455
  • Instant melt-tack >120°C (<10 psi)
  • Curing without fixture and pressure
  • Withstands >300°C short-term exposure
  • Low moisture absorption
  • Proven reliability for large area substrates
>1×1014>2.0>1,500-45Tack free dry film Preforms 3-12 mils (thick)
RTK7556
  • Instant melt-tack >80°C (<10 psi)
  • Curing without fixture and pressure
  • Withstands >250°C wire-bonding
  • Low moisture absorption
  • Proven reliability for large area substrates
>1×1014>3.0>1,500-45Tacky film Preforms 3-12 mils (thick)
TP7155
  • Instant melt-bond >190°C (<10 psi)
  • No post curing
  • Withstands >150°C wire-bonding
  • Low moisture absorption
>1×1>2.0>1,500-40Tack free dry film Preforms 3-12 mils (thick)

For a recommendation, information or assistance, please contact AIT sales and engineering:

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308