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Die attach film adhesives for all die attach applications with 10 micron BLT and stress absorption.
Frequently Asked Questions on Die-Attach Film and Paste Adhesive Materials
1. Do specific AIT products meet the Mil-Std-883F-Method 5011 requirements?
- Almost all of the AIT products engineered for microelectronic bonding have been engineered to meet and exceed all of the requirements.
- Not all of the products have been tested per the requirements and have received certification. For a list of products that have been previously tested and certified, please check the following table of “Mil-Std-883F-Method 5011 adhesives.”
- AIT will perform all required testing for certification if there is a requirement. There may be some nominal testing charges and will be furnished upon request.
2. Do specific AIT products meet NASA Outgassing requirements?
- Most AIT products engineered for microelectronic bonding have been engineered to meet and exceed the NASA outgassing requirements.
- For a list of products that have been tested and certified, please check the following table of “NASA certified adhesives.”
- AIT will perform all required testing for certification if there is a requirement. An official request must be made by a qualified contractor of NASA before any tests can be conducted.
3. Is flexible adhesive a better or higher strength adhesive in terms of reliability?
- Reliability depends on the functional properties and ability to absorb interfacial stresses.
- Flexible adhesive is intrinsically more stable and reliable if all other requirements are met.
- Almost all functional properties are available in film adhesive form from AIT.
- AIT provides the most comprehensive film adhesives in the world covering various electrical and thermal conductivities for large and small parts with flexibility and high bonding strength.
4. Would AIT be willing and able to modify the viscosity and/or other dispensing properties for our requirements?
- AIT has provided solutions to help our customers assemble their parts successfully with high reliability.
- Over the years AIT has worked with its customers to modify its various products .
5. Would AIT be willing and able to work with its customers for a custom adhesive solution?
- AIT has worked with customers for custom material development whenever appropriate.
6. What are the advantages and disadvantages in using paste or film adhesives?
The following table compares various applicable parameters in using paste and film adhesives:
| FUNCTIONAL REQUIREMENTS | PASTE ADHESIVES | FILM ADHESIVES |
|---|---|---|
| 1. Efficiency and flexibility of dispensing | Paste adhesive can be dispensed as a single dot or a “shower” of dots for a small bonding area. For a larger bonding area, it requires different dispensing techniques such as screening and stenciling. Paste adhesive is inherently capable of accommodating height differential and substrate warp. Different bonding areas on a single substrate may require several dispensing heads and are typically more difficult to accommodate. | Film adhesive is more applicable for large area bonding than smaller area bonding. For large and small bonding areas, if film adhesive can be pre-laminated onto substrate and diced into smaller parts the efficiency matches or exceeds that of paste dispensing. AIT has some unique film adhesives that can be tacked at >90°C with pressure and continue curing without pressure for large volume production. |
| 2. Availability and flexibility to have key functional properties | The functional properties are available in paste adhesive format. Most suppliers of adhesives cannot provide the versatility and availability of film adhesive to paste products. | Most functional properties are available in film adhesive format from AIT. AIT provides the most comprehensive film adhesive line in the world covering various electrical and thermal conductivities for large and small parts with flexible and high strength bonding strength. |
| 3. Reliability | Reliability depends on the functional properties and ability to absorb interfacial stresses. A flexible adhesive is intrinsically more stable and reliable when all other requirements are met. | AIT pioneered a comprehensive line of film adhesives along with the more conventional high strength adhesives for smaller bonding areas. |
| 4. Rework-ability | Rework-ability depends on the flexibility of the adhesive at elevated temperatures. | AIT produces a comprehensive line of flexible adhesive films for ease of reworking. |
| 5. Costs | Paste adhesives are generally lower in cost. | Film adhesives need additional steps in manufacturing and thus cost a little more in general. |
7. What are the advantages and disadvantages in using dry film and tacky film adhesives?
The following table compares various applicable parameters in using traditional dry film adhesive vs AIT pioneered tacky film adhesives:
| FUNCTIONAL REQUIREMENTS | DRY FILM ADHESIVE | TACKY FILM ADHESIVE |
|---|---|---|
| 1. Efficiency and flexibility of dispensing and placement of parts to be bonded. | Typical film adhesives use a fiberglass carrier to provide handling properties similar to pre-preg laminate. AIT dry film adhesives are engineered to be self-supporting without fiberglass in general. AIT dry film adhesives are engineered to have either high strength for smaller substrates or high flexibility for large area substrate bonding. AIT has some unique film adhesives that can be tacked at >90°C with pressure and continue curing without pressure for large volume production. | Tacky film adhesive allows immediate and easy positioning of parts on a substrate without heat. AIT tacky film adhesives are engineered to be self-supporting without fiberglass in general. For large and small bonding areas, if film adhesive can be pre-laminated onto substrate and diced into smaller parts the efficiency matches or exceeds that of paste dispensing. AIT tacky film adhesive can also be tacked at >90°C with pressure and continue curing without pressure for large volume production. |
| 2. Availability and flexibility to have key functional properties. | Most all functional properties are available in film adhesive format from AIT. AIT provides the most comprehensive film adhesives in the world covering various electrical and thermal conductivities for large and small parts with flexible and high strength bonding strength. | AIT provides a tacky film adhesive solution with all functional properties. AIT provides the only tacky film adhesives in the world covering various electrical and thermal conductivities for large and small parts with flexible and high strength bonding strength. |
| 3. Reliability | AIT produces a comprehensive line of flexible and high strength film adhesive with outstanding and proven reliability. Flexible adhesives are intrinsically more stable and reliable if all other requirements are met. | AIT pioneered and is the only known supplier of tacky film adhesives with high flexibility and reliability. |
| 4. Rework-ability | Rework-ability depends on the flexibility of the adhesive at elevated temperatures. All AIT dry film adhesives are available with flexible bonding strength for ease of reworking. | AIT produces a comprehensive line of tacky flexible adhesive films for ease of reworking. Rework-ability depends on the flexibility of the adhesive at elevated temperatures. |
| 5. Costs | Dry film adhesive is slightly lower in adhesive film cost because of the ease of handling. | Tacky film adhesive reduces overall cost of manufacturing due to ease of positioning parts. |
8. What is the highest temperature of operations for the AIT adhesives?
All of the AIT films and paste die-attach adhesives have been engineered for their molecular stability for short-term exposure as high as 300°C without any loss of functionality. AIT also offers a comprehensive line of ultra-high temperature film and paste adhesives for both standard backside die-attach and frontside flip-chip attach. These interpenetrating networks of molecularly engineered adhesives not only withstand short-term exposure at 400°C but are also stable for use up to 300°C without thermal degradation.
AIT engineering, technical sales and service:
609-799-9388 or 800-735-5040
Fax: 609-799-9308