Description
PRIMA-SOLDER™ (EG8050) is an electrically conductive, silver filled epoxy which exhibits outstanding flexibility for bonding materials with highly mismatched CTE’s (i.e., alumina to aluminum, silicon to copper). Post bake at 100C or 125C for 24 hrs using a vacuum or air flow oven is recommended in order to pass NASA outgassing testing.
EG8050 can be readily reworked at 80-150ºC and is ideal for applications such as large area die attach and substrate attach because of it’s ability to bond materials with highly mismatched CTE.
