Description
PRIMA-BOND™ (EG7655) is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE’s (i.e., alumina to aluminum, silicon to copper). EG7655’s high thermal conductivity (1.7 W/m-ºC) and flexibility make it excellent for bonding large area substrates, components and heat sinks where thermal management is critical.
This EG7655 is the same material previously sold under Laird part numbers TCE-002 and TCE-003.
