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AI Technology, Inc.
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    • Build-Up Film (BUF) Adhesive Pre-Preg for 3-D Semiconductor and Chiplet Applications
      • Low Dk and Df Build-Up Films and Beyond
      • Build-Up Film with 8-18 PPM/°C CTE
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    • Wafer Processing Adhesives and Solutions
      • Temporary Bonding Adhesive Solutions with Clean Release De-Bonding: Backgrinding and 3D Wafer Processing
      • Wafer Processing Adhesive on Disposable Carrier for Multiplying Wafer Processing Throughput
      • Wafer Processing for High Topography Bumped Wafers: Conforming, Stress-Free Temporary Bonding Adhesive
      • Backgrinding Wax Adhesive Solutions for SiC, Sapphire, GaN, and GaAs Wafers
      • Laser De-Bonding, High Tg, Temporary Bonding Adhesive Solutions
      • Multiplying Wafer Backgrinding Throughput: Backgrinding Temporary Bonding Adhesive on Disposable Carrier
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    • Cavity Electronic Packaging Lid-Seal Solutions
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  • PRIMA-PROTECT™ CC7133-GREY 16 ounces (1 Pint)

    $154.25
    Add to cart Show Details

  • SOLAR-BLOC™ SC7130-UVB 16 ounces (1 Pint)

    $166.11
    Add to cart Show Details
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