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Build-Up Film (BUF) Adhesive Pre-Preg for 3-D Semiconductor and Chiplet Applications
Low Dk and Df Build-Up Films and Beyond
Build-Up Film with 8-18 PPM/°C CTE
Die Attach Adhesives, DAF, and DDAF
Wafer Processing Adhesives and Solutions
Temporary Bonding Adhesive Solutions with Clean Release De-Bonding: Backgrinding and 3D Wafer Processing
Wafer Processing Adhesive on Disposable Carrier for Multiplying Wafer Processing Throughput
Wafer Processing for High Topography Bumped Wafers: Conforming, Stress-Free Temporary Bonding Adhesive
Backgrinding Wax Adhesive Solutions for SiC, Sapphire, GaN, and GaAs Wafers
Laser De-Bonding, High Tg, Temporary Bonding Adhesive Solutions
Multiplying Wafer Backgrinding Throughput: Backgrinding Temporary Bonding Adhesive on Disposable Carrier
Wafer Processing Temporary Bonding Film and Spin Coating Adhesives
Wafer Processing Adhesive for Stress Free and High Topography Temporary Bonding
Wafer-Panel Level Processing (FOWPL-FOPLP) Temporary Bonding Mold Release Tapes
Backgrinding and Dicing Tapes, and Solutions
Wafer Dicing Tapes
Wafer and Substrate Thinning Temporary Bonding Wax Coating and Wax Film
Wafer Back Grinding Tapes
Temporary Bonding Thermal Grease-Gel for Etching Vacuum Chamber
Temporary Bonding Film and Spin Coating Adhesives for Backgrinding
Backgrinding Wax Adhesive Solutions for SiC, Sapphire, GaN, and GaAs Wafers
Multiplying Wafer Backgrinding Throughput: Backgrinding Temporary Bonding Adhesive on Disposable Carrier
Dicing & Grinding Tape FAQs
Substrate and Component Attach Adhesives
Component & Substrate Attach Paste Adhesives
Substrate Attach Film Adhesives
Underfill and Glob-Top Encapsulation
Melt-Flow Film Underfills
Capillary Liquid Underfills
Glob-Top Compounds for COB Protection
Thermal Interface Materials (TIMs)
Compressible and Phase-Change Interface Materials
Thermal Tape Adhesives and Thermal Epoxies
Thermal Gels & Greases
Thermal Management Tips and FAQs
Testimonials on AIT Thermal Interface Materials (TIM)
Cavity Electronic Packaging Lid-Seal Solutions
Lid-Seal Adhesive and Isothermal Sealing Process
LCP-Grade Moisture and Corrosive Gases Barrier FLUOROSEAL®
Wafer Scale Cavity Electronic Packaging with FLUOROSEAL®
Cavity Electronic Packaging Beyond Epoxy Lid-Sealing
Conformal Coatings
Unparalleled Protection: New Types of Coatings
Conformal Coatings for Moisture, Salt-Fog and Water Immersion
PWB Masking Tapes,Coatings and Gels
Frequently Asked Questions (FAQ) About Conformal Coatings
Testimonials
UV & Corrosion Protective Coatings
UV Resistant & Blocking Protection Coatings
EMI/RFI Shielding Coatings and Sealants
Compressible Gasket Sheets
EMI Shielding Laminate Adhesives and Conductive Sealants
Melt-Bonding Lid-Shield
ESD Protection Coatings & Materials
EMI Shielding Tips and FAQs
Coupler Flexible Circuit Substrates
Single-Clad Coupler for Single-Sided Flex Circuit Substrates
Double-Clad Coupler for Double-Sided Flex Circuit Substrates
Coupler Prepreg and Adhesive Film for Multilayer Flex Circuit Substrates
Insulated Metal Substrate for Metal Core Printed Circuit Board
Solar
Thermal Conductive Back Sheets
Transparent Encapsulating PVDF Front Sheet
Instant Melt-Bonding Tabbing Solution
Solar Energy Enhancement Protection Coating, Sealant and Adhesive
LED Thermal Interface Materials
Electric Vehicle (EV) Battery Packaging
Thermal Gap Filling Potting Gel for Cylindrical Cell Packing
High Compressibility, High Temperature Applicable, High Thermal Conduction Fire-Retardant Thermal Interface Pads for EV Battery Assembly
Other Thermal, Electrical and Mechanical Interface Material Solutions for EV Automotive Applications
Automotive Electronic Adhesives & TIMs
Die Attach & TIM’s for CPU
Industrial & Consumer Tapes, Adhesives, Coatings & Sealants
Conformal Coatings for Protecting Electrical and Metal Parts
Labels and Film-Tapes for High Temperature Applications
Custom Adhesives & Materials
Application Analysis
Resources
DATA SHEETS
TEST DATA RESULTS
IPC-CC-830C
Adhesive Bonding Principle
Rework Process
White Papers From AIT
Patents & IP
NASA Outgassing Compliant
MIL-STD 883C 5011.4 Compliant
ISO 9001:2015 Certification
SHARP Certificate
Conflict Minerals Policy
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Replacement Adhesive Products
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AIT Wafer Processing Adhesive Webinar
AIT Conformal Coatings Webinar
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PRIMA-SOLDER™ (EG8020) 1 Ounce Kit (1/2 oz part A and part B)
$
279.51
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PRIMA-SOLDER™ (EG8020) 1/2 Ounce Kit (1/4 oz part A and part B)
$
150.78
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PRIMA-SOLDER™ (EG8050) 1 Ounce Kit (1/2 oz part A and part B)
$
287.91
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PRIMA-SOLDER™ (EG8050) 1/2 Ounce Kit (1/4 oz part A and part B)
$
142.49
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