Molecularly Flexible Epoxy Flexible Circuit Substrate
Conductive Coatings/Gaskets for Emi Shielding: Theory and Practice
Multichip Module Die-Attach with Low Stress, Thermally Conductive Epoxies
Thermal Impedance and Thermal Stress in Electronic Assemblies CHARTS EXAMPLE
Fuel And Moisture Resistant Adhesives for Automotive Electronics and Amp; Other Applications
Flexible, Reworkable, Conductive Adhesive/Coating for Interconnection Applications
Tack-Free Flexible Film Adhesives
Low Tg Epoxy Adhesives for Thermal Management
Z-POXY As Solder Replacement for Surface Mounting Applications
Z-AXIS Conductive Adhesive for Tab and Fine Pitch Interconnects
Development of Z-AXIS Adhesives for SMT Assembly
Ball-Grid-Array Package Thermal Management
New Approach to Low-Cost Cavity Packaging
Second Generation Die and Substrate Attach Flexible Film Adhesive
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 and Fax: 609-799-9308