The following is a list of some AI Technology, Inc. patents that are available for licensing:

Patent # Title

7,154,046 Flexible dielectric electronic substrate and method for making same

6,973,716 Electronic circuit construction method, as for a wireless RF tag

6,938,783 Carrier tape

6,717,819 Solderable flexible adhesive interposer as for an electronic package, and method for making same

6,581,276 Fine-pitch flexible connector, and method for making same

6,580,035 Flexible adhesive membrane and electronic device employing same

6,580,031 Method for making a flexible circuit interposer having high-aspect ratio conductors

6,496,373 Compressible thermally-conductive interface

6,432,253 Cover with adhesive preform and method for applying same

6,428,650 Cover for an optical device and method for making same

6,409,859 Method of making a laminated adhesive lid, as for an Electronic device

6,406,988 Method of forming fine pitch interconnections employing magnetic masks

6,399,178 Rigid adhesive underfill preform, as for a flip-chip device

6,376,769 High-density electronic package, and method for making same

6,316,289 Method of forming fine-pitch interconnections employing a standoff mask

6,297,564 Electronic devices employing adhesive interconnections including plated particles

6,136,128 Method of making an adhesive preform lid for electronic devices

6,108,210 Flip chip devices with flexible conductive adhesive

4,695,404 Hyperconductive filled polymers

US 11,222,864 Semiconductor Wafer Processing Arrangement Employing an Adhesive Sheet and Method for Processing a Semiconductor Wafer

ZL 2011 8 0039097.1 Solar Cell Interconnection, Module, Panel and Method

PAT. NO.Title
6,496,373AI Technology, Inc.Compressible thermally-conductive interface
7,743,963AI Technology, Inc.Solderable lid or cover for an electronic circuit
7,458,472AI Technology, Inc.Re-usable carrier structure
7,154,046AI Technology, Inc.Flexible dielectric electronic substrate and method for making same
6,973,716AI Technology, Inc.Electronic circuit construction method, as for a wireless RF tag
6,938,783AI Technology, Inc.Carrier tape
6,886,246AI Technology, Inc.Method for making an article having an embedded electronic device
6,717,819AI Technology, Inc.Solderable flexible adhesive interposer as for an electronic package, and method for making same
6,665,193AI Technology, Inc.Electronic circuit construction, as for a wireless RF tag
6,581,276AI Technology, Inc.Fine-pitch flexible connector, and method for making same
6,580,035AI Technology, Inc.Flexible adhesive membrane and electronic device employing same
6,580,031AI Technology, Inc.Method for making a flexible circuit interposer having high-aspect ratio conductors
6,432,253AI Technology, Inc.Cover with adhesive preform and method for applying same
6,428,650AI Technology, Inc.Cover for an optical device and method for making same
6,409,859AI Technology, Inc.Method of making a laminated adhesive lid, as for an Electronic device
6,406,988AI Technology, Inc.Method of forming fine pitch interconnections employing magnetic masks
6,404,643AI Technology, Inc.Article having an embedded electronic device, and method of making same
6,376,769AI Technology, Inc.High-density electronic package, and method for making same
6,297,564AI Technology, Inc.Electronic devices employing adhesive interconnections including plated particles
6,288,905AI Technology, Inc.Contact module, as for a smart card, and method for making same
6,136,128AI Technology, Inc.Method of making an adhesive preform lid for electronic devices
6,108,210AI Technology, Inc.Flip chip devices with flexible conductive adhesive

For more information and recommendation assistance, please contact AIT sales and engineering:

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AIT technical sales and service department can also be reached at: 1-609-799-9388 and Fax: 609-799-9308