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AI Technology, Inc.
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    • Build-Up Film (BUF) Adhesive Pre-Preg for 3-D Semiconductor and Chiplet Applications
      • Low Dk and Df Build-Up Films and Beyond
      • Build-Up Film with 8-18 PPM/°C CTE
    • Die Attach Adhesives, DAF, and DDAF
    • Wafer Processing Adhesives and Solutions
      • Temporary Bonding Adhesive Solutions with Clean Release De-Bonding: Backgrinding and 3D Wafer Processing
      • Wafer Processing Adhesive on Disposable Carrier for Multiplying Wafer Processing Throughput
      • Wafer Processing for High Topography Bumped Wafers: Conforming, Stress-Free Temporary Bonding Adhesive
      • Backgrinding Wax Adhesive Solutions for SiC, Sapphire, GaN, and GaAs Wafers
      • Laser De-Bonding, High Tg, Temporary Bonding Adhesive Solutions
      • Multiplying Wafer Backgrinding Throughput: Backgrinding Temporary Bonding Adhesive on Disposable Carrier
      • Wafer Processing Temporary Bonding Film and Spin Coating Adhesives
      • Wafer Processing Adhesive for Stress Free and High Topography Temporary Bonding
      • Wafer-Panel Level Processing (FOWPL-FOPLP) Temporary Bonding Mold Release Tapes
    • Backgrinding and Dicing Tapes, and Solutions
      • Wafer Dicing Tapes
      • Wafer and Substrate Thinning Temporary Bonding Wax Coating and Wax Film
      • Wafer Back Grinding Tapes
      • Temporary Bonding Thermal Grease-Gel for Etching Vacuum Chamber
      • Temporary Bonding Film and Spin Coating Adhesives for Backgrinding
      • Backgrinding Wax Adhesive Solutions for SiC, Sapphire, GaN, and GaAs Wafers
      • Multiplying Wafer Backgrinding Throughput: Backgrinding Temporary Bonding Adhesive on Disposable Carrier
      • Dicing & Grinding Tape FAQs
    • Substrate and Component Attach Adhesives
      • Component & Substrate Attach Paste Adhesives
      • Substrate Attach Film Adhesives
    • Underfill and Glob-Top Encapsulation
      • Melt-Flow Film Underfills
      • Capillary Liquid Underfills
      • Glob-Top Compounds for COB Protection
    • Thermal Interface Materials (TIMs)
      • Compressible and Phase-Change Interface Materials
      • Thermal Tape Adhesives and Thermal Epoxies
      • Thermal Gels & Greases
      • Thermal Management Tips and FAQs
      • Testimonials on AIT Thermal Interface Materials (TIM)
    • Cavity Electronic Packaging Lid-Seal Solutions
      • Lid-Seal Adhesive and Isothermal Sealing Process
      • LCP-Grade Moisture and Corrosive Gases Barrier FLUOROSEAL®
      • Wafer Scale Cavity Electronic Packaging with FLUOROSEAL®
      • Cavity Electronic Packaging Beyond Epoxy Lid-Sealing
    • Conformal Coatings
      • Unparalleled Protection: New Types of Coatings
      • Conformal Coatings for Moisture, Salt-Fog and Water Immersion
      • PWB Masking Tapes,Coatings and Gels
      • Frequently Asked Questions (FAQ) About Conformal Coatings
      • Testimonials
    • UV & Corrosion Protective Coatings
      • UV Resistant & Blocking Protection Coatings
    • EMI/RFI Shielding Coatings and Sealants
      • Compressible Gasket Sheets
      • EMI Shielding Laminate Adhesives and Conductive Sealants
      • Melt-Bonding Lid-Shield
      • ESD Protection Coatings & Materials
      • EMI Shielding Tips and FAQs
    • Coupler Flexible Circuit Substrates
      • Single-Clad Coupler for Single-Sided Flex Circuit Substrates
      • Double-Clad Coupler for Double-Sided Flex Circuit Substrates
      • Coupler Prepreg and Adhesive Film for Multilayer Flex Circuit Substrates
    • Insulated Metal Substrate for Metal Core Printed Circuit Board
    • Solar
      • Thermal Conductive Back Sheets
      • Transparent Encapsulating PVDF Front Sheet
      • Instant Melt-Bonding Tabbing Solution
      • Solar Energy Enhancement Protection Coating, Sealant and Adhesive
    • LED Thermal Interface Materials
    • Electric Vehicle (EV) Battery Packaging
      • Thermal Gap Filling Potting Gel for Cylindrical Cell Packing
      • High Compressibility, High Temperature Applicable, High Thermal Conduction Fire-Retardant Thermal Interface Pads for EV Battery Assembly
      • Other Thermal, Electrical and Mechanical Interface Material Solutions for EV Automotive Applications
    • Automotive Electronic Adhesives & TIMs
    • Die Attach & TIM’s for CPU
    • Industrial & Consumer Tapes, Adhesives, Coatings & Sealants
      • Conformal Coatings for Protecting Electrical and Metal Parts
      • Labels and Film-Tapes for High Temperature Applications
    • Custom Adhesives & Materials
  • Application Analysis
  • Resources
    • DATA SHEETS
    • TEST DATA RESULTS
    • IPC-CC-830C
    • Adhesive Bonding Principle
    • Rework Process
    • White Papers From AIT
    • Patents & IP
    • NASA Outgassing Compliant
    • MIL-STD 883C 5011.4 Compliant
    • ISO 9001:2015 Certification
    • SHARP Certificate
    • Conflict Minerals Policy
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DATA SHEETS

COOL SILVER G4

COOL SILVER G5

CB7078

CB7208-EDA2

CC7130-PRTC CONFORMAL COATING

CP7508

CP8503-HF

EG7635

EG7655

EG8050

EG8050-HC

ESP8350

ME7155

ME7158

ME7159

ME7155-SC4 PRIMA BOND

ME7650-RC PRIMA BOND

ME8155-M

ME8412 PRIMA SOLDER

ME8418 PRIMA SOLDER

ME8418-SC DIE ATTACH

ME8452

ME8452-A PRIMA SOLDER

ME8456

ME8630-SSC DIE ATTACH

ME8650-RC INLINE DIE ATTACH

RTK7659

SC7130-CC CONFORMAL COATING

TC8750

TK7755

TK7759

TP7205

TP7209

TP7855

TP8205

 

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