Follow a manual added linkWant to learn about temporary bonding for wafer processing and backgrinding
Want to learn about temporary bonding for wafer processing and backgrinding
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how you can increase your process throughput?
If you missed our free webinar, don’t worry! You can always view the recording of our webinar here:
For a copy of the AIT wafer processing & backgrinding adhesives presentation please click here
This webinar will examine standard wafer processing adhesives and processes and the improvements needed to increase throughput. The current industry standard temporary bonding adhesives for wafer processing require time intensive debonding methods and cleaning steps for both the carrier and the device wafer itself.
AI Technology, Inc. presents novel temporary bonding solutions to multiply throughput in wafer processing and backgrinding. These include clean release adhesive innovations and adhesives on disposable carrier.