- Dielectric, Electrically Conductive and/or Thermally Conductive
- Snap-Curing series with 100% solid for ultimate productivity
- Wire-bonding capable to 250°C for faster throughput applications
- Usage temperatures from standard Mil-Std and automotive electronics to >250°C specialty applications
- Large area low-stress series
- Choices of viscosities for screening-stenciling or pin-transfer
- Choices of electrical and/or thermal performance based on silver, gold, diamond, alumina, aluminum and boron nitride, and other specialty metals and derivatives
- Tg=240°C and -55°C and combinations for specialty applications
- Die-Attach Film (DAF) for precision and high-density die-attaching
- Dielectric, Electrically Conductive and/or Thermally Conductive
- Controlled to Snap-Curing with high melt-flow for ultimate performance
- Wire-bonding capable to 250°C for faster throughput applications
- Usage temperatures from standard Mil-Std and automotive electronics to >250°C usage specialty applications
- Choices of electrical and/or thermal performance based on silver, gold, diamond, alumina, aluminum and boron nitride, and other specialty metals and derivatives
- Tg=240°C and -55°C and combinations for specialty applications
- Die-Attach Film (DAF) on UV releasing or peel-release dicing tapes (DDAF)
- Dielectric, Electrically Conductive and/or Thermally Conductive
- Controlled to Snap-Curing with high melt-flow for ultimate performance
- Wire-bonding capable to 250°C for faster throughput applications
- Usage temperatures from standard Mil-Std and automotive electronics to >250°C usage specialty application
- Choices of electrical and/or thermal performance based on silver, gold, diamond, alumina, aluminum and boron nitride, and other specialty metals and derivatives
- Tg=240°C and -55°C and combinations for specialty applications